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yellow2 Products for PCB Assembly
yellow2 Chemicals for PCB
yellow2.gif (175 bytes) Products for Automotive, Engineering and Plumbing Industries
 
   
  yellow2.gif (175 bytes)SOLDER STRIPPERS (NON PEROXIDE) - 2529
   
  It is acid base chemical solution formulated to effectively remove tin/lead and tin plated surfaces from copper substrate. It does not contain peroxide or fluorides. Type Z is non foaming and can be used either by spraying or dipping. Type N is a foaming type and is used by dipping only.
   
  yellow2.gif (175 bytes)SOLDER CONDITIONER - 1410
   
  It is an acid base chemical cleaner for cleaning and conditioning tin/lead plated surfaces. It removes ammonia salt residues formed during alkaline etching. It can also be used as a presoldering cleaner to improve solderability by removing oxides formed during storage. 
   
  yellow2.gif (175 bytes)SOLDER BRIGHTNER - 2727
   
  It is a non-halogen, acid chemical cleaner for cleaning and conditioning tin/lead plated surfaces. It contains additives to enhance reflow characteristics when used as a precleaner prior to infrared or hot oil fusing. It will remove ammonia salt residues formed in alkaline etching system and oxides formed during storage.
   
  yellow2.gif (175 bytes)COPPER CLEANER - 3033
   
  It is an acid, organic, water soluble, sprayable cleaner to remove organic and inorganic soils such as finger prints, light oil and tarnish from copper surfaces prior to application of protective coatings, solder mask, dryfilm photoresist or ink.
   
  yellow2.gif (175 bytes)FLUX - 1539 (H.A.L.)
   
  ICM - 1539 HAL FLUX is a low viscosity organic liquid formulation developed for Solder Coating of printed circuit boards by hot air levelling equipment. The residue of flux is water soluble.
   
  yellow2.gif (175 bytes)FLUX - 506 (RT)
   
  It is an organic liquid formulation developed for solder coating of printed circuit boards by roller coating equipment. The residue of flux is water soluble. (The process is also known as Roll Tinning).
   
  yellow2.gif (175 bytes)FLUX - 205 (I.R.)
   
  ICM - 205 I.R. FLUX is an organic liquid formulation developed for use in reflow of solder plated printed circuit boards by infra-red fusing equipment. The residue of ICM - 205 is completely soluble in water.
   
  yellow2.gif (175 bytes)RT-861 (ROLL TINNING SALT)
  ICM RT-861 is a whitish granular powder. It contains halogens and it acts as a flux and a dross reducer and enhances solder spread during roll tinning of printed circuits.
   
  yellow2.gif (175 bytes)PROTECOT (PROTECTIVE COATING)
   
  It is a rosin based coating developed to preserve the solderability of printed circuit boards by protecting clean metallic surfaces from atmospheric oxidation and other contamination. It can be applied by spraying, dipping or brushing to a circuit board which has been cleaned and water rinsed.