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Products for PCB Assembly Chemicals for PCB Products for Automotive, Engineering and Plumbing Industries       ROSIN ACTIVATED FLUXES (RA TYPE)         These Fluxes are clear, homogenous solutions of WW grade rosin in special alcohol solvent systems with effective activating agents. They can be applied by foaming, dipping or spraying.       FLUX - 15C   It is a liquid solution with approximately 15% solids containing water white rosin blended solvent system with activators. The chlorides are approximately 0.1%. The surfactants incorporated into the flux yield relatively tackfree residues.       FLUX - 615   ICM 615-FOAM FLUX is a liquid solution with approximately 15% solids containing water white rosin blended solvent system into which a small amount of effective activating agent is incorporated. The chlorides are approximately 0.25%.       FLUX - 638   ICM 638-FOAM FLUX is a liquid solution with approximately 38% solids containing ww-rosin with activators and surfactants. The chlorides are approximately 0.2%.         ROSIN MILDLY ACTIVATED FLUXES (RMA TYPE)         These Fluxes contain WW-rosin and solvent systems similar to RA fluxes, however, the activation is so incorporated that the chlorides are within 0.075%. They can be applied by foaming, dipping or spraying.       FLUX - 7A   ICM 7A FLUX is a liquid solution with approximately 8% solids containing water white rosin blended solvent system with which effective activators are so incorporated that the chlorides are maximum 0.055%.         ROSIN NONACTIVATED FLUX (R TYPE)         These Fluxes contain WW-rosin and solvent systems without any activating agents. They can be applied by foaming, dipping or spraying.       FLUX - RN40   It is a liquid solution with approximately 40% solids containing WW rosin in solvents system without any activating agent.       ORGANIC WATER SOLUBLE FLUXES         Organic fluxes provide greater fluxing action than rosin but the ionizable nature of the water-soluble residues necessitate their adequate removal, generally with deionised water.       FLUX - 103   It is a water soluble organic activated flux. It is especially adaptable for foam fluxing, however, it can also be applied by dipping or brushing. It is used where inorganic fluxes are too corrosive to use and rosin fluxes are too inactive for the application. It is essential that the flux residues be completely and adequately removed.         NO CLEAN - LOW SOLIDS FLUXES         The no-clean fluxes are halogen-free with low solids. They leave very little residues that require no-cleaning. The non-corrosive and non-conductive characteristics of the residues usually yield higher surface insulation resistance than the residues of typical organic water soluble flux. They can be applied by foaming, dipping, spraying.       FLUX - 707   It is halogen-free, modified rosin, low solids solvent designed for wave soldering conventional and surface mount circuit board assemblies.       FLUX - 708   It is halogen-free, non-rosin, low solids solvent system designed for similar application as Flux-707. It contains synthetic resin.       FLUX - 709   It is halogen-free, rosin-resin free, with lower solids percentage solvent system designed for similar application as Flux-707. However, it has less foaming action than Flux - 707.     FLUX - 915 (VOC - Free) It is a VOC-free, halogen-free foamable flux with low solids water based system. Although it is a No Clean Flux the flux residues are water soluble and can be cleaned with deionised water.     TINNING OIL       A refined synthetic oil for use as a blanket on top of molten solder to minimize dross.       SOLDER BARS       High purity of Tin and Lead uniformly alloyed in 63/37 or 60/40 proportion for optimum performance and process consistency.       SOLDERING WIRE       Soldering Wire or flux-cored wire made with high purity tin and lead alloyed in various required popertions.       FLUX PASTE HAND SOLDERING       For applications where a liquid flux is inconvenient to use these paste formulations are available.       FLUX PASTE-S-18A (ROSIN ACTIVATED)   It is a blend of water white rosin, surfactants and activators especially formulated for assembling printed circuits. It can be applied to the areas to be soldered by any convenient method.       FLUX PASTE S7-MA (ROSIN MILDLY ACTIVATED)   It is a liquid solution with approximately 8% solids containing water white rosin blended solvent system with which effective activators are so incorporated that the chlorides are maximum 0.055%.       FLUX PASTE NC 04 (NO CLEAN)   It is a non-rosin halogen-free paste with surfactant and activator especially formulated for assembling printed circuits. It is less active than Flux Pastes S-18A and S-18MA             Typical Temperature / Specific Gravity behaviour of Fluxes               PCB ASSEMBLY FLUXES - PERFROMANCE CRITERIA Criteria Characte-ristics No Clean Low Solids Fluxes Rosin Fluxes Organic Water Soluble Fluxes           Reliability  surface insulation resistance - SIR high low-without cleaning high-with cleaning High-with cleaning but generally lower than other two fluxes . . . . corrosivity, hygroscopic- ness negative negative negative after adequate cleaning . . . . . Functionality solderability good good good . . . . magnitude and nature of residues low (not necessary to remove) medium (optional to remove) corrosive (must be removed) . . . . . Operational Latitude ease in applying & controlling needs more control easier than No Clean Flux easy . . . . ease in residue removal removal not necessary less easy to remove easy and less expensive to remove but cleaing medium needs to be monitored & controlled . . .   compatibility to solder wide spectrum of boards & components narrow medium wide             SOLDER STRIPPERS (NON PEROXIDE) - 2529       It is acid base chemical solution formulated to effectively remove tin/lead and tin plated surfaces from copper substrate. It does not contain peroxide or fluorides. Type Z is non foaming and can be used either by spraying or dipping. Type N is a foaming type and is used by dipping only.       SOLDER CONDITIONER - 1410       It is an acid base chemical cleaner for cleaning and conditioning tin/lead plated surfaces. It removes ammonia salt residues formed during alkaline etching. It can also be used as a presoldering cleaner to improve solderability by removing oxides formed during storage.        SOLDER BRIGHTNER - 2727       It is a non-halogen, acid chemical cleaner for cleaning and conditioning tin/lead plated surfaces. It contains additives to enhance reflow characteristics when used as a precleaner prior to infrared or hot oil fusing. It will remove ammonia salt residues formed in alkaline etching system and oxides formed during storage.       COPPER CLEANER - 3033       It is an acid, organic, water soluble, sprayable cleaner to remove organic and inorganic soils such as finger prints, light oil and tarnish from copper surfaces prior to application of protective coatings, solder mask, dryfilm photoresist or ink.       FLUX - 1539 (H.A.L.)       ICM - 1539 HAL FLUX is a low viscosity organic liquid formulation developed for Solder Coating of printed circuit boards by hot air levelling equipment. The residue of flux is water soluble.       FLUX - 506 (RT)       It is an organic liquid formulation developed for solder coating of printed circuit boards by roller coating equipment. The residue of flux is water soluble. (The process is also known as Roll Tinning).       FLUX - 205 (I.R.)       ICM - 205 I.R. FLUX is an organic liquid formulation developed for use in reflow of solder plated printed circuit boards by infra-red fusing equipment. The residue of ICM - 205 is completely soluble in water.       RT-861 (ROLL TINNING SALT)   ICM RT-861 is a whitish granular powder. It contains halogens and it acts as a flux and a dross reducer and enhances solder spread during roll tinning of printed circuits.       PROTECOT (PROTECTIVE COATING)       It is a rosin based coating developed to preserve the solderability of printed circuit boards by protecting clean metallic surfaces from atmospheric oxidation and other contamination. It can be applied by spraying, dipping or brushing to a circuit board which has been cleaned and water rinsed.